Liquid crystal display and manufacturing method thereof

ABSTRACT

A liquid crystal display includes a thin film transistor on a substrate, a pixel electrode connected to a first terminal of the thin film transistor, a roof layer above the pixel electrode, a microcavity between the pixel electrode and the roof layer, the microcavity including a liquid crystal injection hole, a partition wall in the microcavity, the partition wall partitioning the microcavity into a first area and a second area, and a liquid crystal layer with liquid crystal molecules in the microcavity, the liquid crystal molecules in the first area being a different type than the liquid crystal molecules in the second area.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2013-0083127, filed on Jul. 15, 2013,in the Korean Intellectual Property Office, and entitled: “LiquidCrystal Display and Manufacturing Method Thereof,” is incorporated byreference herein in its entirety.

BACKGROUND

1 . Field

Embodiments relate to a liquid crystal display and a manufacturingmethod thereof.

2 . Description of the Related Art

A liquid crystal display is one of the widely used flat panel displays,and includes two display panels with electric field generatingelectrodes, e.g., a pixel electrode and a common electrode, and a liquidcrystal layer between the two display panels. An image is displayed byapplying voltage to the electric field generating electrodes to generatean electric field in the liquid crystal layer, determining orientationof liquid crystal molecules of the liquid crystal layer through thegenerated electric field, and controlling polarization of incidentlight.

A liquid crystal display may include a NCD (Nano Crystal Display). Amethod of manufacturing the NCD includes forming a sacrificial layerwith an organic material, forming a support member on an upper part,removing the sacrificial layer to define a microcavity, and filling themicrocavity defined by the removal of the sacrificial layer with aliquid crystal.

SUMMARY

An exemplary embodiment provides a liquid crystal display including athin film transistor on a substrate, a pixel electrode connected to afirst terminal of the thin film transistor, a roof layer above the pixelelectrode, a microcavity between the pixel electrode and the roof layer,the microcavity including a liquid crystal injection hole, a partitionwall in the microcavity, the partition wall partitioning the microcavityinto a first area and a second area, and a liquid crystal layer withliquid crystal molecules in the microcavity, the liquid crystalmolecules in the first area being a different type than the liquidcrystal molecules in the second area.

When an electric field is applied to the liquid crystal layer, degreesof inclination of the liquid crystal molecule in the first area and thesecond area may be different from each other.

The liquid crystal molecules injected into the first area and the secondarea may respectively have different dielectric constants.

The liquid crystal display may include a common electrode locatedbetween the microcavity and the roof layer.

The liquid crystal display may include an alignment layer locatedbetween the microcavity and the common electrode.

The partition wall may include an equal material to a material formingthe alignment layer.

A part where the common electrode and the roof layer protrude to a lowerend may be located at a part corresponding to the partition wall.

The partition wall may be formed by filling the common electrode and theroof layer.

The liquid crystal display may further include a sustain electrode linelocated on the substrate, wherein the partition wall is located at apart which overlaps the sustain electrode line.

The pixel electrode may include a first pixel electrode and a secondpixel electrode located at the first area and the second area,respectively, and the first pixel electrode and the second pixelelectrode may be connected to each other.

The liquid crystal injection hole may include a first liquid crystalinjection hole located at the first area and a second liquid crystalinjection hole located at the second area, and the first liquid crystalinjection hole and the second liquid crystal injection hole may belocated at opposite sides based on the partition wall.

Another exemplary embodiment provides a method of manufacturing a liquidcrystal display, the method including forming a thin film transistor ona substrate, forming a pixel electrode to be connected with a firstterminal of the thin film transistor, forming a sacrificial layer on thepixel electrode, forming a roof layer on the sacrificial layer, removingthe sacrificial layer to form a microcavity between the pixel electrodeand the roof layer, the microcavity including a liquid crystal injectionhole, forming a partition wall in the microcavity, the partition wallpartitioning the microcavity into a first area and a second area,injecting a first liquid crystal material into the first area andinjecting a second liquid crystal material into the second area, thefirst liquid crystal material and the second liquid crystal materialbeing different types, and forming a capping layer on the roof layer tocover the liquid crystal injection hole.

Degrees of inclinations of a liquid crystal molecule included in thefirst liquid crystal material and a liquid crystal molecule included inthe second liquid crystal material may be different from each other inthe first area and the second area.

The liquid crystal molecules injected into the first area and the secondarea may respectively have different dielectric constants.

The method may further include forming an open part in a part where thefirst area and the second area meet by patterning the sacrificial layer,wherein forming the roof layer may include forming the roof layer whilefilling the open part.

The method may further include forming a lower insulating layer beforeforming the roof layer, wherein the lower insulating layer may be formedwhile covering the open part.

The liquid crystal injection hole may include a first liquid crystalinjection hole and a second liquid crystal injection hole, the (“first”)liquid crystal material may be injected through the first liquid crystalinjection hole, and the second liquid crystal material may be injectedthrough the second liquid crystal injection hole.

The first liquid crystal injection hole and the second liquid crystalinjection hole may be located at opposite sides based on the partitionwall.

The method may further include injecting an alignment material into themicrocavity; and drying the alignment material, wherein the partitionwall may be formed by remaining solids after the alignment material isdried.

The method may further include forming a recess part at a part where thefirst area and the second area meet by patterning the sacrificial layer,wherein forming the roof layer may include forming the roof layer whilefilling the recess part.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments with reference to theattached drawings, in which:

FIG. 1 illustrates a top plan view of a liquid crystal display accordingto an exemplary embodiment;

FIG. 2 illustrates a cross-sectional view taken along line II-II of FIG.1;

FIG. 3 illustrates a perspective photograph of a microcavity accordingto an exemplary embodiment;

FIG. 4 illustrates a cross-sectional view taken along line IV-IV of FIG.1;

FIG. 5 illustrates a cross-sectional view of a liquid crystal displayaccording to an exemplary embodiment;

FIG. 6 illustrates a cross-sectional view of a liquid crystal displayaccording to an exemplary embodiment;

FIGS. 7, 8A-8C, and 9-14 illustrate cross-sectional views of stages in amethod of manufacturing a liquid crystal display according to anexemplary embodiment.

DETAILED DESCRIPTION

Exemplary embodiments will be described in detail below with referenceto the accompanying drawings. As those skilled in the art would realize,the described embodiments may be modified in various different ways, allwithout departing from the spirit or scope of the exemplaryimplementations. On the contrary, exemplary embodiments introducedherein are provided to make disclosed contents thorough and complete forthose skilled in the art.

In the drawings, the thickness of layers, films, panels, regions, etc.,may be exaggerated for clarity. It will be understood that when a layeris referred to as being “on” another layer or substrate, it can bedirectly on the other layer or substrate, or intervening them may alsobe present. Like reference numerals designate like elements throughoutthe specification.

FIG. 1 illustrates a top plan view of a liquid crystal display accordingto an exemplary embodiment. FIG. 2 illustrates a cross-sectional viewalong line II-II of FIG. 1. FIG. 3 illustrates a perspective view of amicrocavity according to an exemplary embodiment. FIG. 4 illustrates across-sectional view along line IV-IV of FIG. 1.

Referring to FIGS. 1 to 3, a gate line 121 and a sustain electrode line131 may be located on an insulation substrate 110, e.g., a transparentglass substrate or a plastic substrate. The gate line 121 includes agate electrode 124. The sustain electrode line 131 extends in ahorizontal direction and transmits a predetermined voltage, e.g., acommon voltage (Vcom). The sustain electrode line 131 is locatedsubstantially in parallel to the gate line 121 and includes a pair ofsustain electrode parts 135 extending from a part parallel to the gateline 121 to face each other.

A gate insulating layer 140 may be formed on the gate line 121 and thesustain electrode line 131. A linear semiconductor layer (not shown)located on a lower part of a data line 171, a semiconductor layer 154located on lower parts, e.g., surfaces, of source/drain electrodes173/175, and a channel part of a thin film transistor Q may be locatedon the gate insulating layer 140.

An ohmic contact may be located between the linear semiconductor layerand the data line or the semiconductor layer 154 and the source/drainelectrode 173/175, but is omitted in the drawing. Data conductors 171,173, and 175 including the data line 171, the source electrode 173connected with the data line 171, and the drain electrode may be areformed on the linear semiconductor layer, the semiconductor layer 154,and the gate insulating layer 140. The gate electrode 124, the sourceelectrode 173, and the drain electrode 175 form, e.g., define, the thinfilm transistor Q together with the semiconductor layer 154, and achannel of the thin film transistor Q is formed on a part of thesemiconductor layer 154 between the source electrode 173 and the drainelectrode 175.

A first interlayer insulating layer 180 a may be formed on the dataconductors 171, 173, and 175, and an exposed part of the semiconductorlayer 154. The first interlayer insulating layer 180 a may include aninorganic insulator or organic insulator, e.g., silicon nitride(SiN_(x)) and silicon oxide (SiO_(x)).

A color filter 230 and a light blocking member 220 may be formed on thefirst interlayer insulating layer 180 a . The light blocking member 220may be configured in a lattice structure having an opening correspondingto an area displaying an image and formed of a material which lightcannot penetrate. The color filter 230 may be formed on the opening ofthe light blocking member 220. The color filter 230 is located tocorrespond to the area displaying the image, i.e., in a pixel area.

The color filter 230 may display one of the primary colors, e.g., threeprimary colors including red, green and blue. However, the colorsdisplayed by the color filter 230 are not limited to the three primarycolors including red, green and blue, and the color filter 230 maydisplay one color in the white spectrum, e.g., cyan, magenta, or yellow.The color filter 230 may be formed of a material displaying differentcolors for each of the adjacent pixels.

A second interlayer insulating layer 180 b for covering the color filter230 and the light blocking member 220 may be formed on the color filter230 and the light blocking member 220. The second interlayer insulatinglayer 180 b may include an inorganic insulator or an organic insulator,e.g., silicon nitride (SiN_(x)) and silicon oxide (SiO_(x)). Unlike thecross-sectional view illustrated in FIG. 2, when a step is generated dueto a difference between thicknesses of the color filter 230 and lightblocking member 220, it may be possible to reduce or remove the step byincluding an organic insulator in the second interlayer insulating layer180 b . A contact hole 185 exposing the drain electrode 175 may beformed through the color filter 230, the light blocking member 220, andthe interlayer insulating layers 180 a and 180 b.

A pixel electrode 191 may be formed on the second interlayer insulatinglayer 180 b . The pixel electrode 191 may be formed of a transparentconductive material, e.g., ITO or IZO. The pixel electrode 191 mayinclude a first pixel electrode 191 a and a second pixel electrode 191 b. The first pixel electrode 191 a and the second pixel electrode 191 bhave overall shapes of a first quadrangle and a second quadrangle,respectively, and the first quadrangle of the first pixel electrode 191a may be smaller than the second quadrangle of the second pixelelectrode 191 b.

In detail, referring to FIG. 1, the first pixel electrode 191 a and thesecond pixel electrode 191 b may look like they are structurallyseparated from each other at a part that overlaps the sustain electrodeline 131. However, the first pixel electrode 191 a and the second pixelelectrode 191 b are physically and electrically connected to each otherthrough a connection electrode 91.

Each of the first pixel electrode 191 a and the second pixel electrode191 b includes a cross branch part including a horizontal branch partand a vertical branch part crossing the horizontal branch part. Further,each of the first pixel electrode 191 a and the second pixel electrode191 b is divided into four sub areas by the horizontal branch part andthe vertical branch part, and each of the sub areas includes a pluralityof fine branch parts. In addition, in the present exemplary embodiment,a peripheral branch part surrounding a peripheral area of the pixelelectrode 191 may be further included.

The fine branch part of the pixel electrode 191 may form an angleranging from about 40 to 45 degrees with the gate line 121. Further,fine branch parts of two adjacent sub areas may be orthogonal to eachother. In addition, a width of the fine branch part may gradually becomewider, or intervals between the fine branch parts may be different.

The first pixel electrode 191 a is physically and electrically connectedwith the drain electrode 175 through the contact hole 185, and receivesa data voltage from the drain electrode 175. Since the first pixelelectrode 191 a and the second pixel electrode 191 b are connected bythe connection electrode 91, the first pixel electrode 191 a and thesecond pixel electrode 191 b receive the same voltage.

The thin film transistor Q and the pixel electrode 191 are only oneexample, and a structure of a thin film transistor and a design of apixel electrode may be changed to improve visibility at a side.

A lower alignment layer 11 is formed on the pixel electrode 191, e.g.,the lower alignment layer 11 may be a vertical alignment layer. Thelower alignment layer 11 is a liquid crystal alignment layer, e.g.,polyamic acid, polysiloxane, or polyimide.

An upper alignment layer 21 is located at a part facing the loweralignment layer 11, and a microcavity 305 is formed between the loweralignment layer 11 and the upper alignment layer 21. A liquid crystalmaterial including a liquid crystal molecule 310 is injected into themicrocavity 305 through a liquid crystal injection hole 307. Themicrocavity 305 may be formed in a column direction of the pixelelectrode 191, e.g., in a vertical direction. In the present exemplaryembodiment, an alignment material forming the alignment layers 11 and 21and a liquid crystal material including the liquid crystal molecule 310may be injected into the microcavity 305 by using capillary force.

Referring to FIG. 3, the microcavity 305 is vertically divided by aplurality of liquid crystal injection hole forming areas 307FP locatedat parts overlapping the gate line 121, so a plurality of microcavities305 may be formed in a direction D where the gate line 121 extends. Eachof the plurality of formed microcavities 305 may correspond to a pixelarea PX, and the pixel area PX may correspond to an area displaying ascreen. At this time, the liquid crystal injection hole 307 is formed ina direction where the liquid crystal injection hole forming area 307FPextends. Further, although not illustrated, an interval betweenmicrocavities 305 neighboring each other along the direction D, i.e., ina direction parallel to the gate line 121, is covered by a roof layer360 (FIG. 2).

Referring back to FIG. 2, a common electrode 270 and a lower insulatinglayer 350 may be located on the upper alignment layer 21. The commonelectrode 270 receives a common voltage, and generates an electric fieldtogether with the pixel electrode 191 receiving a data voltage, so as todetermine a direction in which the liquid crystal molecule 310 locatedat the microcavity 305 between the two electrodes inclines. The commonelectrode 270 and the pixel electrode 191 define a capacitor to maintainthe applied voltage even after the thin film transistor is turned off.The lower insulating layer 350 may be formed of, e.g., silicon nitride(SiN_(x)) or silicon oxide (SiO₂).

Although it has been described that the common electrode 270 is formedon the microcavity 305 in the present exemplary embodiment, the commonelectrode 270 may be formed on a lower part of the microcavity 305 todrive the liquid crystal according to an in-plane switching mode inanother exemplary embodiment.

The roof layer 360 is located on the lower insulating layer 350. Theroof layer 360 serves to provide support, such that the microcavity 305corresponding to a space between the pixel electrode 191 and the commonelectrode 270 can be formed. The roof layer 360 may include photoresistor other organic materials.

An upper insulating layer 370 may be located on the roof layer 360. Theupper insulating layer 370 may contact an upper surface of the rooflayer 360. The upper insulating layer 370 may be formed of, e.g.,silicon nitride (SiN_(x)) or silicon oxide (SiO₂).

A capping layer 390 is located on the upper insulating layer 370. In thepresent exemplary embodiment, the capping layer 390 contact an uppersurface and a side surface of the upper insulating layer 370 and alsocontacts a side surface of the roof layer 360 exposed to the outside.The capping layer 390 covers the liquid crystal injection hole 307 ofthe microcavity 305 exposed by the liquid crystal injection hole formingarea 307FP while filling the liquid crystal injection hole forming area307FP. The capping layer 390 may be formed of, e.g., a thermosettingresin, silicon oxycarbide (SiOC), or graphene.

An overcoat (not shown) formed of an inorganic layer or an organic layermay be located on the capping layer 390. The overcoat serves to protectthe liquid crystal molecule 310 injected into the microcavity 305 fromexternal impact and to planarize a layer, e.g., the capping layer 390.

A polarizer (not shown) is located on a lower part of the insulationsubstrate 110 and on an upper part of the upper insulating layer 370.The polarizer may include a polarization device generating polarizationand a TAC (tri-acetyl-cellulose) layer for securing durability.Directions of transmissive axes of the polarizer, i.e., an upperpolarizer and a lower polarizer may, be orthogonal or parallel to eachother in some exemplary embodiments.

Referring to FIG. 4, the microcavity 305 corresponds to one pixel areaPX, which may include a first area X and a second area Y. The first areaX and the second area Y of the pixel area PX are partitioned by apartition wall 400, e.g., the partition wall 400 may completely separatethe first and second areas X and Y of the pixel area PX.

The partition wall 400 may include a same material as that forming thealignment layers 11 and 21. For example, the partition wall 400 may beformed by lumpy solid materials left after being dried during formationof the alignment layers 11 and 21. The partition wall 400 may beparallel to the sustain electrode line 131, e.g., perpendicular to thegate line 121. For example, the partition wall 400 may be integral withthe alignment layers 11 and 21 to surround, e.g., define, themicrocavity 305. For example, the partition wall 400 may define asidewall of the microcavity 305, e.g., a height of the partition wall400 may equal a height of the microcavity 305.

The first pixel electrode 191 a is positioned in, e.g., to correspondto, the first area X, and a second pixel electrode 191 b is positionedin, e.g., to correspond to, the second area Y. As described above, thefirst pixel electrode 191 a and the second pixel electrode 191 b arephysically and electrically connected by the connection electrode 91.

A first liquid crystal injection hole 307A is formed in the first areaX, and a second liquid crystal injection hole 307B is formed in thesecond area Y. The first liquid crystal injection hole 307A and thesecond liquid crystal injection hole 307B are located at oppositepositions based on the partition wall 400, i.e., on opposite sides ofthe partition wall 400.

In the present exemplary embodiment, a first liquid crystal molecule 310a is injected into the first area X through the first liquid crystalinjection hole 307A, and a second liquid crystal molecule 310 b isinjected into the second area Y through the second liquid crystalinjection hole 307B. The first liquid crystal molecule 310 a and thesecond liquid crystal molecule 310 b may have different physicalproperties. For example, the first liquid crystal molecule 310 a and thesecond liquid crystal molecule 310 b may have different dielectricconstants. Therefore, a same microcavity 305 corresponding to a singlepixel area PX may include liquid crystal molecules of different types,i.e., two types of liquid crystal molecule 310 b in two different partsof the same pixel area PX.

Therefore, when voltage is applied to the pixel electrode 191 and thecommon electrode 270, i.e., when an electric field is formed in theliquid crystal layer, slopes of the first liquid crystal molecule 310 aand the second liquid crystal molecule 310 b are different from eachother, i.e., are not aligned, due to their different physicalproperties. In contrast, when only one type of liquid crystal moleculesis used in the microcavity, formation of an electric field in the liquidcrystal layer causes all the liquid crystal molecules to align at a sameangle, e.g., after being vertically aligned in response to no electricfield in the liquid crystal layer.

Accordingly, since slopes of the first liquid crystal molecule 310 a andthe second liquid crystal molecule 310 b in respective first and secondareas X and Y are different from each other, the voltage-transmittancecurve lines in the first and second areas X and Y of the same pixel areaPDX are different from each other. As such, a luminance value varieswhile the pixel area part corresponding to the first area X and thepixel area part corresponding to the second area Y have differentvoltage-transmittance curve lines (in spite of being in a same pixelarea), thereby improving display, e.g., visibility, properties.

Further, in the present exemplary embodiment, there is one thin filmtransistor connected to one pixel area. Nevertheless, the visibility canbe improved by injecting different liquid crystal materials into thefirst area X and the second area Y partitioned by the partition wall400, so that a structure of the thin film transistor may be simplified.

FIG. 5 illustrates a cross-sectional view of a liquid crystal displayaccording to another exemplary embodiment.

Referring to FIG. 5, a liquid crystal display according to anotherexemplary embodiment may be substantially the same as that describedpreviously with reference to FIGS. 1-4, with the exception of having aheight of a partition wall 400′ to be smaller than a height of themicrocavity 305. That is, an upper part DP of the partition wall 400′may be dented downwardly, and the upper part DP may be covered by thecommon electrode 270, the lower insulating layer 350, and the roof layer360.

FIG. 6 illustrates a cross-sectional view of a liquid crystal displayaccording to another exemplary embodiment.

Referring to FIG. 6, a liquid crystal display according to anotherexemplary embodiment may be substantially the same as that describedpreviously with reference to FIGS. 1-4, with the exception of having anempty space between the first area X and the second area Y to define apartition wall 400″. Further, the common electrode 270, the lowerinsulating layer 350, and the roof layer 360 may be conformally formedto cover the empty space. The dried solids forming the alignment layers11 and 21 may remain around the partition wall 400, but the lumpy degreedescribed in FIGS. 4 and 5 is very low or there may be no remainingsolids.

FIGS. 7 to 14 illustrate cross-sectional views of stages in amanufacturing method of a liquid crystal display according to anexemplary embodiment. FIGS. 7 to 14 illustrate a process order accordingto a cross-sectional view taken along line IV-IV of FIG. 1.

Referring to FIG. 7, the sustain electrode line 131 extending inparallel to the thin film transistor and the gate line may be formed onthe substrate 110. The first interlayer insulating layer 180 a may beformed to cover the thin film transistor. The color filter 230 and thelight blocking member 220 may be foamed on the first interlayerinsulating layer 180 a, and the second interlayer insulating layer 180 bmay be formed on the color filter 230 and the light blocking member 220.The pixel electrode 191 may be formed on the second interlayerinsulating layer 180 b . The pixel electrode 191 may be formed toinclude the first pixel electrode 191 a corresponding to a first reservearea XP and the second pixel electrode 191 b corresponding to a secondreserve area YP.

FIGS. 8A, 8B, and 8C illustrate various exemplary embodiments of formingthe sacrificial layer 300, respectively.

Referring to FIG. 8A, the sacrificial layer 300 may be formed on thepixel electrode 191, e.g., to have a flat top surface. In the presentexemplary embodiment, the sacrificial layer 300 may be formed to coverthe first pixel electrode 191 a, the second pixel electrode 191 b, and agap between the first pixel electrode 191 a and the second pixelelectrode 191 b in one pixel area.

Referring to FIG. 8B, according to another exemplary embodiment, adented part DP may be formed in the sacrificial layer 300, afterformation of the sacrificial layer 300 on the pixel electrode 191, bypatterning the sacrificial layer 300. The dented part DP may be formedin a direction in which the sustain electrode line 131 extends. Thedented part DP may be formed by using a slit mask or controlling anexposure amount.

Referring to FIG. 8C, according to another exemplary embodiment, an openpart OPN may be formed in the sacrificial layer 300, after formation ofthe sacrificial layer 300 on the pixel electrode 191, by patterning thesacrificial layer 300. The open part OPN may be formed in a direction inwhich the sustain electrode line 131 extends. The open part OPN mayleave a part of the sacrificial layer 300 at a lower end of the openpart OPN in order not to expose the second interlayer insulating layer180 b or the pixel electrode 191.

FIGS. 9 to 12 illustrate the following process according to an exemplaryembodiment described in FIG. 8A.

Referring to FIG. 9, the common electrode 270, the lower insulatinglayer 350, and the roof layer 360 may be sequentially formed on thesacrificial layer 300. The roof layer 360 may be located between thepixel areas neighboring in a vertical direction by exposure anddevelopment processes and may be removed from an area corresponding tothe light blocking member 220. The roof layer 360 exposes the lowerinsulating layer 350 to the outside in the area corresponding to thelight blocking member 220. The upper insulating layer 370 may be formedto cover the roof layer 360 and the exposed lower insulating layer 350.

Referring to FIG. 10, the upper insulating layer 370, the lowerinsulating layer 350, and the common electrode 270 may be etched by anetching mask. The liquid crystal injection hole forming area 307FP maybe formed by partially removing the upper insulating layer 370, thelower insulating layer 350, and the common electrode 270. Next, thesacrificial layer 300 may be removed by O₂ ashing processing or a wetetching method through the formed liquid crystal injection hole formingarea 307FP. At this time, the microcavity 305 having the liquid crystalinjection holes 307A and 307B at both edges is formed. That is, theremoval of the sacrificial layer 300 defines an empty space between thecommon electrode 270 and the pixel electrode 191, so the microcavity 305is defined in the empty space.

Referring to FIG. 11, the alignment layers 11 and 21 are formed on thepixel electrode 191 and the common electrode 270 by injecting analignment material through the liquid crystal injection hole 307. Forexample, a bake process is performed after the alignment material,including solids and a solvent, is injected through the liquid crystalinjection hole 307. Next, both the liquid crystal injection holes 307Aand 307B simultaneously are dried, and thus the solids become lumpywithin the microcavity 305. That is, the solids are the remainingcomponents in the microcavity 305, after the solvent of the alignmentmaterial evaporates, thereby forming the partition wall 400 within themicrocavity 305. The partition wall 400 partitions the microcavity 305into the first area X and the second area Y.

Referring to FIG. 12, a first liquid crystal material including thefirst liquid crystal molecule 310 a is injected through the first liquidcrystal injection hole 307A, and a second liquid crystal materialincluding the second liquid crystal molecule 310 b is injected throughthe second liquid crystal injection hole 307B. Thereafter, the cappinglayer is formed on the upper insulating layer 370 to cover the liquidcrystal injection holes 307A and 307B, so the liquid crystal displayillustrated in FIG. 4 is formed.

Hereinafter, the following process according to an exemplary embodimentdescribed in FIGS. 8B and 8C will be described.

The components of the exemplary embodiment described in FIG. 8B areformed through almost the same method used in the exemplary embodimentdescribed FIG. 8A. However, since the dented part DP is formed in thestep described in FIG. 8B, the components on the sacrificial layer 300are formed to fill the dented part DP in the step of forming the commonelectrode 270, the lower insulating layer 350, and the roof layer 360.Further, since a height of a part where the dented part DP is formed islower than heights of both the liquid crystal injection holes 307A and307B, the capillary force increases, thereby causing the solids tobecome lumpy, e.g., aggregate, in the dented part DP to form thepartition wall 400′. In general, the capillary force within astructurally narrow space has a large effect.

The following process according to the exemplary embodiment described inFIG. 8C will be described with reference to FIGS. 13 and 14.

Referring to FIG. 13, the common electrode 270, the lower insulatinglayer 350, and the roof layer 360 are formed while filling the open partOPN on the sacrificial layer 300 after the step of FIG. 8C. Thereafter,the liquid crystal injection hole forming region 307FP is formed throughthe same patterning method described in FIGS. 9 and 10. The sacrificiallayer 300 is removed by O₂ ashing processing or a wet etching methodthrough the formed liquid crystal injection hole forming area 307FP. Atthis time, the microcavity 305 having the liquid crystal injection holes307A and 307B is formed at both edges. In the present exemplaryembodiment, since the partition wall 400″ has been already formed, thefirst area X and the second area Y are formed in the present step. Thefirst area X has a closed structure in which the first liquid crystalinjection hole 307A is formed at one edge of the first area X and thepartition wall 400 is formed at the other edge. The second area Y has aclosed structure in which the second liquid crystal injection hole 307Bis formed at one edge of the second area Y and the partition wall 400 isformed at the other edge.

Referring to FIG. 14, the alignment layers 11 and 21 are formed on thepixel electrode 191 and the common electrode 270 by injecting analignment material through each of the liquid crystal injection holes307A and 307B. For example, a bake process is performed after thealignment material, including solids and a solvent, is injected throughthe liquid crystal injection hole 307. At this time, since the firstarea X and the second area Y have a structure in which one edge of thefirst area X and the second area Y is partitioned with the partitionwall 400, unlike the exemplary embodiment described in FIGS. 8A and 8B,a phenomenon in which the solids lumps within the first area X and thesecond area Y is not generated.

In addition to the aforementioned differences, the description of thefollowing process of the exemplary embodiment described in FIG. 8A or 8Bmay be equally applied to the following process of the exemplaryembodiment described in FIG. 8C.

By way of summary and review, a conventional method of manufacturing aliquid crystal display, e.g., a NCD, includes a process of injecting andthen drying an alignment liquid, before injecting liquid crystalmolecules into a microcavity. During the process of drying the alignmentliquid, solids of the alignment liquid agglomerate into scattered lumps,thereby causing light leakage and/or transmittance deterioration.

In contrast, according to example embodiments, a liquid crystal displaymay include a partition wall formed of the solid/lumpy alignmentmaterial, thereby preventing or substantially minimizing scattering ofsolid/lumpy alignment material in the microcavity. Further, displaycharacteristics, e.g., visibility, maybe improved by injecting differenttypes of liquid crystal materials into respective areas partitioned bythe partition wall.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A liquid crystal display, comprising: a thin filmtransistor on a substrate; a pixel electrode connected to a firstterminal of the thin film transistor; a roof layer above the pixelelectrode; a microcavity between the pixel electrode and the roof layer,the microcavity including a liquid crystal injection hole; a firstalignment layer on the pixel electrode; a partition wall in themicrocavity, the partition wall partitioning the microcavity into afirst area and a second area; and a liquid crystal layer with liquidcrystal molecules in the microcavity, the liquid crystal molecules inthe first area being a different type than the liquid crystal moleculesin the second area, wherein the partition wall includes a same materialas the first alignment layer.
 2. The liquid crystal display as claimedin claim 1, wherein, when an electric field is applied to the liquidcrystal layer, inclination degrees of the liquid crystal molecules inthe first area and the second area are different from each other.
 3. Theliquid crystal display as claimed in claim 2, wherein the liquid crystalmolecules in the first area have a different dielectric constant thanthe liquid crystal molecules in the second area.
 4. The liquid crystaldisplay as claimed in claim 1, wherein the first alignment layer isbetween the microcavity and the pixel electrode, the first alignmentlayer being in direct contact with an entire upper surface of the pixelelectrode.
 5. The liquid crystal display as claimed in claim 1, furthercomprising: a common electrode disposed between the microcavity and theroof layer; and a second alignment layer disposed between themicrocavity and the common electrode.
 6. The liquid crystal display asclaimed in claim 5, wherein the partition wall has a lower height thanthe microcavity, respective parts of the common electrode and of theroof layer being bent toward the partition wall.
 7. The liquid crystaldisplay as claimed in claim 5, wherein the microcavity includes anopening, respective parts of the common electrode and of the roof layerfilling the opening to define the partition wall.
 8. The liquid crystaldisplay as claimed in claim 1, further comprising a storage electrodeline on the substrate, the partition wall overlapping the storageelectrode line.
 9. The liquid crystal display as claimed in claim 1,wherein the pixel electrode includes a first pixel electrode and asecond pixel electrode disposed at the first area and the second area,respectively, the first pixel electrode and the second pixel electrodebeing connected to each other.
 10. The liquid crystal display as claimedin claim 1, wherein the liquid crystal injection hole includes a firstliquid crystal injection hole disposed at the first area and a secondliquid crystal injection hole disposed at the second area, the firstliquid crystal injection hole and the second liquid crystal injectionhole being at opposite sides of the partition wall.
 11. A method ofmanufacturing a liquid crystal display, the method comprising: forming athin film transistor on a substrate; forming a pixel electrode to beconnected with a first terminal of the thin film transistor; forming afirst alignment layer on the pixel electrode; forming a sacrificiallayer on the first alignment layer; forming a roof layer on thesacrificial layer; removing the sacrificial layer to form a microcavitybetween the first alignment layer and the roof layer, the microcavityincluding a liquid crystal injection hole; forming a partition wall inthe microcavity, the partition wall including a same material as thefirst alignment layer and partitioning the microcavity into a first areaand a second area; injecting a first liquid crystal material into thefirst area and injecting a second liquid crystal material into thesecond area, the first liquid crystal material and the second liquidcrystal material being different types; and forming a capping layer onthe roof layer to cover the liquid crystal injection hole.
 12. Themethod as claimed in claim 11, wherein, when an electric field isapplied to the first and second liquid crystal material, inclinationdegrees of liquid crystal molecules in the first liquid crystal materialand liquid crystal molecules in the second liquid crystal material aredifferent from each other.
 13. The method as claimed in claim 12,wherein the liquid crystal molecules injected into the first area andthe second area have respectively different dielectric constants. 14.The method as claimed in claim 11, further comprising patterning thesacrificial layer to form an open part between the first area and thesecond area, the roof layer extending into the open part to fill theopen part.
 15. The method as claimed in claim 14, further comprisingforming a lower insulating layer, before forming the roof layer, suchthat the lower insulating layer extends into the open part.
 16. Themethod as claimed in claim 11, wherein the liquid crystal injection holeincludes a first liquid crystal injection hole and a second liquidcrystal injection hole, the first liquid crystal material being injectedthrough the first liquid crystal injection hole, and the second liquidcrystal material being injected through the second liquid crystalinjection hole.
 17. The method as claimed in claim 16, wherein the firstliquid crystal injection hole and the second liquid crystal injectionhole are disposed at opposite sides of the partition wall.
 18. Themethod as claimed in claim 11, further comprising: injecting analignment material into the microcavity; and drying the alignmentmaterial, such that the partition wall is formed by remaining solids ofthe dried alignment material.
 19. The method as claimed in claim 18,further comprising patterning the sacrificial layer to form a recesspart between the first area and the second area, the roof layerextending into the recess part.